These are a computer chip cooling method using thin films of matter to transfer heat away from computer chips.
Advantages:
Draws more heat than air coolers.
Draws heat away faster than water coolers.
Allows for more powerful chips than current technology.
Combines advantages of current air and water cooling.
Mitigates disadvantages of current air and water cooling.
Disadvantages:
Requires more control than current technologies.
Fledging technology.
More expensive than current technology.
Unknown if it is feasible for common computing use.
In the experimental stage.
